Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1989-02-14
1990-05-08
Ryan, Patrick
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428220, 428224, 428260, 428289, 428290, 428332, 4284111, 428457, 428458, 428480, 4285395, 428577, 428615, 428901, 427 96, 156 60, 156228, 430311, 430313, 430315, 430319, B32B 900
Patent
active
049236784
ABSTRACT:
This invention provides improved prepregs for producing laminates and improved laminates using such prepregs. Processes for producing the prepregs and the laminates are also provided. Processes for producing the prepreg include the steps of providing a dipping solution or suspension comprising a polynorbornene polymer, a polyolefin polymer derived from C.sub.2 -C.sub.4 monomers, and a solvent followed by impregnating a non-cellulosic cloth with the solution. The solvent is removed from the cloth to form the prepreg. Printed circuit boards are also provided by a process which includes the steps of providing such a prepreg and pretreating the surface of a conductive film with a solution of a silane compound, effective to increase the bond strength between the copper foil and the prepreg, followed by laminating the prepreg to the conductive film.
REFERENCES:
patent: 3318758 (1967-05-01), Tell
patent: 3508983 (1970-04-01), Origer et al.
patent: 3558423 (1971-01-01), Rossetti, Jr.
patent: 4136247 (1979-01-01), Tenney et al.
patent: 4178424 (1979-12-01), Tenney et al.
patent: 4241132 (1980-12-01), Pratt et al.
patent: 4292106 (1981-09-01), Herschdorfer et al.
patent: 4315970 (1982-02-01), McGee
patent: 4329270 (1982-05-01), Meyer, Jr. et al.
patent: 4366280 (1982-12-01), Yukawa
patent: 4372800 (1983-02-01), Oizumi et al.
patent: 4444951 (1984-04-01), Mendelson
patent: 4451317 (1984-05-01), Oizumi et al.
patent: 4571279 (1986-02-01), Oizumi et al.
patent: 4639285 (1987-01-01), Suzuki et al.
patent: 4831094 (1989-05-01), Stein et al.
Chemical Abstract No. 98:162024m, "Metal Covered Laminates".
Chemical Abstract No. 98:162025n, "Metal Covered Laminates".
Chemical Abstract No. 98:162026p, "Metal Covered Laminates".
Chemical Abstract No. 72:124634r, "Hybrid Polyimide/Epoxy Glass Multilayer Fabrication".
Chemical Abstract No. 105:135048d, "Multi-Layer Circuit Boards".
Chemical Abstracts No. 107:97841p, "Polycyclic Olefin Laminated Boards".
Chemical Abstract No. 107:8574p, "Epoxy Prepregs for Printed-Wiring Boards".
Chemical Abstract No. 107:8575q, "Epoxy Prepregs for Printed-Wiring Boards".
WPI No. 83-00996K/01, "Metal Glass Laminated Plate Manufacture Using Adhesive Comprising Silyl-Modified Organic Polymer".
WPI No. 83-759725/37, "Bonding Copper Foil to Backing Material Using Silane Compound as Adhesion Promoter; PCB Print Circuit Board".
WPI No. 74-34559V/19, "Metallized Plastic Substrate, e.g., Electronic Circuit--By Laminating Pretreated Metal Sheet with Plastic Substrate, Removing Metal Layer, and Metallizing Exposed Surface".
WPI No. 85-162927/27, "Copper Coated Laminated Plate Production for PCB, Using Unsaturated Resin, e.g., Polyester or Vinyl Ester to Impregnate Base Material".
"Today's Substrates", Murray, Circuits Manufacturing, Nov. 1987, p. 25.
"G-10FR Epoxy/Glass Fabric General Purpose Laminate", Norplex, Product Bulletin.
"Adhesion in Mineral-Organic Composites", D. M. Brewis, D. Briggs, John Wiley & Sons, Industrial Adhesion Problems, Chapter 6.
The Kirk-Othmer Encyclopedia of Chemical Technology, John Wiley & Sons, 1982, vol. 20.
"Some Approaches to Low Dielectric Constant Matrix Resins for Printed Circuit Boards", Butler et al., 15th National SAMPE Technical Conference, 1983.
Benedikt George M.
Tenney Linwood P.
Ryan Patrick
The B. F. Goodrich Company
LandOfFree
Low dielectric constant prepreg based on blends of polynorbornen does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low dielectric constant prepreg based on blends of polynorbornen, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low dielectric constant prepreg based on blends of polynorbornen will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2348009