Method of bonding a ceramic composite body to a second body and

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228176, 228198, 164 97, B23K10316

Patent

active

051040298

ABSTRACT:
This invention relates generally to a novel method of manufacturing a composite body and to novel products made thereby. More particularly, the invention relates to a method of producing a self-supporting composite body comprising one or more boron-containing compounds, e.g., a boride or a boride and carbide, by reactive infiltration of molten parent metal into a bed or mass containing boron carbide, and, optionally, one or more inert fillers and permitting residual or excess parent metal to remain bonded to the formed self-supporting composite body. The residual or excess metal is used to form a bond between the formed composite body and another body (e.g., a metal body, a ceramic body, or another composite body). In addition, this invention related to alternative methods of disposing metal on at least one surface of the above-described composite bodies (such as sputtering, CVD, etc.) to permit the composite bodies to be bonded to another body.

REFERENCES:
patent: 4055451 (1977-10-01), Cockbain et al.
patent: 4834938 (1989-05-01), Pyzik et al.
patent: 4875616 (1989-10-01), Nixdorf

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of bonding a ceramic composite body to a second body and does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of bonding a ceramic composite body to a second body and , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of bonding a ceramic composite body to a second body and will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2343587

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.