Method of making a current sensor

Details Method of making a current sensor Method of making a current sensor

1988-10-18

1990-05-08

Gorski, Joseph M.

Metal working

Method of mechanical manufacture

Electrical device making

29603, 29834, 29860, 29871, 360113, H05K 334, G11B 5127, H01F 706

Patent

active

049226061

ABSTRACT:
A method of making a current sensor device is disclosed wherein a sensor, having a magnetoresistive element configured into a bridge, an insulating substrate and a conductive member are sub-assembled and then the sub-assembly is heated to bond the components together. The bridge is attached to a first substrate having a first layer of insulation with first vias therein in which are deposited first elements of solder projecting beyond the first layer of insulation. Second elements of (e.g.) solder are deposited in second vias in a second layer of insulation on the second substrate. When the components are sub-assembled, the first elements rest on the second elements to provide a clearance between the first and second layers of insulation. Heat is applied to the sub-assembly in a controlled manner so that the (solder) elements melt sufficiently to cause a degree of self-alignment between the bridge and the conductive member and to cause the bridge to be disposed at a predetermined distance above the conductive member.

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B. Baranowski, W. Kwiatkowski, and S. Tumanski, "Application of the Thin Film Permalloy Magnetoresistive Sensors in Electrical Measurements," IEEE Trans. on Magnetics, vol. Mag-20, No. 5, Sep. 1984.

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