Patent
1986-08-15
1988-07-05
Carroll, J.
357 231, 357 2311, 357 56, 357 59, 357 89, 357 90, H01L 2978, H01L 2712, H01L 2904, H01L 2906
Patent
active
047558636
ABSTRACT:
A high-performance, high-integration, and a highly reliable semiconductor device has a semiconductor substrate, an element isolation layer of an insulating material which is formed on the semiconductor substrate, a monocrystalline semiconductor layer formed on the portion of the semiconductor substrate and isolated from the element isolation layer, and a semiconductor element formed in the monocrystalline semiconductor layer. The impurity concentration of at least the surface region of the semiconductor substrate which is covered with the element isolation layer is not less than 10.sup.16 /cm.sup.3.
REFERENCES:
patent: 3728161 (1973-04-01), Moline
patent: 3966501 (1976-06-01), Nomura et al.
patent: 4101350 (1978-07-01), Possley et al.
patent: 4251828 (1981-02-01), Sakuri
patent: 4329704 (1982-05-01), Sakuri et al.
patent: 4331708 (1983-05-01), Hunter
patent: 4338622 (1982-07-01), Feth et al.
patent: 4412868 (1983-11-01), Brown et al.
patent: 4434433 (1984-02-01), Nishizawa
patent: 4441246 (1984-04-01), Redwine
patent: 4467040 (1984-07-01), Ho et al.
patent: 4471525 (1984-09-01), Sasaki
patent: 4487639 (1984-12-01), Lam et al.
patent: 4504333 (1985-03-01), Kurosawa
patent: 4514747 (1985-04-01), Miyata et al.
A. S. Grove, Physics and Technology, of Semiconductor Devices, John Wiley & sons, New York (1967), pp 78-83.
Iwai Hiroshi
Maeda Satoshi
Carroll J.
Kabushiki Kaisha Toshiba
LandOfFree
Semiconductor device having a semiconductor substrate with a hig does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device having a semiconductor substrate with a hig, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a semiconductor substrate with a hig will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2335704