Aqueous adhesive composition, and bonding process and bonded art

Details Aqueous adhesive composition, and bonding process and bonded art Aqueous adhesive composition, and bonding process and bonded art

1998-02-04

2000-04-18

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

525288, 524547, C09J 400

Patent

active

060510978

ABSTRACT:
An aqueous adhesive composition is provided which comprises a water-soluble condensation polymer obtained by subjecting a specific copolymer having an alkoxyl group and a specific alkoxysilane to hydrolysis-condensation, and an aqueous medium containing the condensation polymer. This composition can firmly bond non-sulfur-curable elastomer materials to various adherends such as metals; this has been hitherto difficult. A high-grade adhesion and superior heat resistance and oil resistance can be attained. No organic solvent is contained, promising an environmental safety.

REFERENCES:
patent: 4721750 (1988-01-01), Nakamura et al.
patent: 5240992 (1993-08-01), Yamaya
Chemical Abstracts, vol. 123, No. 16. Oct. 16, 1995 (Oct. 16, 1995) Columbus, Ohio, US; abstract No. 201286, XP002113830 *abstract* & JP 06 322219 (A Sekisui Chem. Co.).

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