Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-02-06
2000-04-18
Mayes, Curtis
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156261, 156298, 156305, 1563066, 1563069, 22818022, 29852, 427 97, B32B 3100, H01L 2100
Patent
active
060510935
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a mounting method of semiconductor element for mounting a flip chip type semiconductor element on a circuit board of semiconductor element at high reliability and high density.
BACKGROUND ART
Conventional mounting methods of semiconductor element are described below by referring to the drawings.
(Prior Art 1)
FIG. 16 is a sectional view of mounting a semiconductor element on a circuit board in prior art 1.
In FIG. 16, reference numeral 1 is a semiconductor element, an electrode 2 is formed on the semiconductor element 1, and a protruding bump (metal ball bump) 15 made of gold, copper, aluminum, solder or the like is formed on the electrode 2 by wire bonding method.
Reference numeral 4 is a circuit board made of an insulating substrate, and a copper foil 5 to be used as wiring is formed on this circuit board 4, and a copper-plated external electrode terminal 6 is formed on the circuit board 4. To conduct within the circuit board, a hole 8 formed in the circuit board 4 is filled with conductive paste 7.
Reference numeral 22 is a conductive paste (conductive adhesive) having conductive powder of silver, gold, nickel, carbon or the like dispersed uniformly on phenol or epoxy resin. The external electrode terminal 6 of the circuit board 4 and the electrode 2 of the semiconductor element 1 are electrically connected with each other through the protruding bump 15. The space between the circuit board 4 and semiconductor element 1 is filled with epoxy resin 20.
A mounting method of thus constituted semiconductor device is described below.
The conductive paste 22 is transferred on the protruding bump 15 formed on each electrode 2 of the semiconductor element 1 by transfer method, it is mounted so that the protruding bump 15 may coincide with the external electrode terminal 6 of the circuit board 4 to be mounted, and then it is heated to cure the conductive paste 22. In this way, the electrode 2 of the semiconductor element 1 and the external electrode terminal 6 of the circuit board 4 are electrically connected. After the connection, the space between the semiconductor element 1 and circuit board 4 is filled with the epoxy resin 20, and by making use of the shrinking force of its curing, continuous contact of the conductive powder of the conductive paste 22 is obtained, so that electrical and mechanical reliability is assured.
(Prior Art 2)
FIG. 17 is a sectional view of mounting a semiconductor element on a circuit board in prior art 2. Same parts as in the constitution in FIG. 16 are identified with same reference numerals and their explanation is omitted.
In FIG. 17, reference numeral 23 is a metal bump formed on an electrode 2 by electric plating method, and the metal bump 23 is, for example, plated with copper and further plated with gold 24. Reference numeral 25 is an external electrode terminal, and 16 is a passivation film for protecting the active surface of the semiconductor element 1.
A mounting method of thus constituted semiconductor device is described below.
The conductive paste 22 is transferred on the metal bump 23 formed on each electrode 2 of the semiconductor element 1 by transfer method, it is mounted so that the metal bump 23 may coincide with the external electrode terminal 25 of the circuit board 4 to be mounted, and then it is heated to cure the conductive paste 22. In this way, the electrode 2 of the semiconductor element 1 and the external electrode terminal 25 of the circuit board 4 are electrically connected. After the connection, the space between the semiconductor element 1 and circuit board 4 is filled with the epoxy resin 20, and by making use of the shrinking force of its curing, continuous contact of the conductive powder of the conductive paste 22 is obtained, so that electrical and mechanical reliability is assured.
(Prior Art 3)
FIG. 18 is a sectional view of mounting a semiconductor element on a circuit board in prior art 3. Same parts as in the constitution in FIG. 16 and FIG. 17 are identified with same reference numerals a
REFERENCES:
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5274916 (1994-01-01), Kawabata et al.
patent: 5384952 (1995-01-01), Matsui
patent: 5407864 (1995-04-01), Kim
patent: 5615477 (1997-04-01), Sweitzer
patent: 5843251 (1998-01-01), Tsukagoshi et al.
patent: 5848466 (1998-12-01), Viza et al.
European Search Report for Int'l Appln No. 97925302.8 dated Feb. 26, 1999.
Japanese language search report for Int'l Appln. No. PCT/JP97/01971 dated Dec. 8, 1997.
English translation of Form PCT/IS/210.
Gray Linda L.
Matsushita Electric - Industrial Co., Ltd.
Mayes Curtis
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