Plastic packaged integrated circuit with heat spreader

Details Plastic packaged integrated circuit with heat spreader Plastic packaged integrated circuit with heat spreader

1995-03-16

1997-01-21

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 174 522, 361719, H05K 720

Patent

active

055964850

ABSTRACT:
A heat spreader with one or more integrally formed open regions discourages the formation of air bubbles in the encapsulant of a plastic packaged integrated circuit. Little or no air bubbles can be trapped between the heat spreader and the encapsulant surface. Any air bubbles that do form in the encapsulant can escape through the open regions of the heat spreader. The heat spreader of the invention is placed on the surface of a liquid encapsulant and the encapsulant fills the open regions of the heat spreader and covers the sides of the open regions. When the encapsulant hardens, a form fitting bond between the heat spreader and the upper surface of the encapsulant is created. This form fitting bond provides for secure attachment of the heat spreader to the surface of the encapsulant. One embodiment of the heat spreader of the invention includes integrally formed tabs with which a supplementary heat spreader, such as heat tower, is inserted for even greater heat dissipation capability.

REFERENCES:
patent: 4809053 (1989-02-01), Kuraishi
patent: 5105259 (1992-04-01), McShane
patent: 5225710 (1993-07-01), Westerkamp
patent: 5241133 (1993-08-01), Mullen, III
patent: 5309320 (1994-05-01), Smith
patent: 5311060 (1994-05-01), Rostoker
patent: 5353193 (1994-10-01), Chia
patent: 5367196 (1994-11-01), Mahulikar

Affiliated with

Also associated with

Rating

Plastic packaged integrated circuit with heat spreader does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plastic packaged integrated circuit with heat spreader, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic packaged integrated circuit with heat spreader will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2329159