Method and apparatus for wafer chamfer polishing

Details Method and apparatus for wafer chamfer polishing Method and apparatus for wafer chamfer polishing

1993-06-07

1996-08-20

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451 57, 451180, 451292, 451 66, B24B 906

Patent

active

055474152

ABSTRACT:
A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60.degree. to transfer the wafers.

REFERENCES:
patent: 5094037 (1992-03-01), Hakomori et al.
patent: 5097630 (1992-03-01), Maeda et al.
patent: 5117590 (1992-06-01), Kudo et al.

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