Automatic ball placing device

Details Automatic ball placing device Automatic ball placing device

1996-03-12

1998-01-06

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Solid flux or solid filler

228246, 221269, H05K 330, B23K 306

Patent

active

057045364

ABSTRACT:
An automatic ball placing device can automatically attach the solder ball to the pad of BGA's (Ball Grid Array) substrate. It comprises mainly a BGA substrate fixing device, a stencil fixing seat at least, a horizontal driving device, a vertical driving device and a swinging device. The BGA substrate possesses multiple stencil. The horizontal driving device and the vertical driving device can drive the said BGA substrate fixing device to perform horizontal and vertical movement respectively so as to move the BGA substrate to the position below the stencil fixing seat and thereby, make the solder balls drop into the mesh of the stencil which facilitates the solder balls to attach to the pad of BGA's substrate.

REFERENCES:
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5482736 (1996-01-01), Glenn et al.

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