Method of manufacturing hermetically sealed compression bonded c

Details Method of manufacturing hermetically sealed compression bonded c Method of manufacturing hermetically sealed compression bonded c

1988-08-01

1989-05-16

Hearn, Brian E.

Fishing, trapping, and vermin destroying

427222, 357 81, 357 74, 174 523, 174 524, 174 5051, H01L 300

Patent

active

048309796

ABSTRACT:
A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (74, 76, 78 and 80) to be compression bonded, a hermetically sealed circuit assembly having circuit elements to be compression bonded and a stack containing at least one hermetically sealed circuit assembly having circuit elements which are compression bonded is disclosed. Uniform thickness of individual hermetically sealed circuit assemblies measured across columns (22-30) is insured by positioning deformable spacers (124-132) in the columns containing the circuit elements to be compression bonded, and deforming the deformable spacers so that a surface of each of the deformed spacers lies within a single plane. Thereafter a compressive force is applied to a stack of one or more circuits through the columns which contain the circuit elements to be compression bonded. The individual hermetically sealed circuit assemblies have circular corrugations (32-40) in a flat surface (14) and circular corrugations (114-122) in a lid (20) which are disposed within the columns containing the individual circuit elements to be compression bonded to permit freedom of motion in all directions of the individual circuit elements to be compression bonded without applying torsional or other loads to any other circuit elements to be compression bonded. Furthermore, all circuit buses (50, 52, 54 and 68) contain one or more corrugations (56, 58, 60, 62, 64 and 66) between each circuit element to be compression bonded and external connections (42-48) to couple the circuit elements to be compression bonded to the exterior of the hermetically sealed chamber (200) and in circuit buses between any adjacent circuit elements to be compression bonded.

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