Vacuum fixture and method for fabricating electronic assemblies

Details Vacuum fixture and method for fabricating electronic assemblies Vacuum fixture and method for fabricating electronic assemblies

1994-08-29

1996-08-20

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29743, 29852, 29DIG44, 279 3, H05K 330, H05K 342, B23P 1904

Patent

active

055466540

ABSTRACT:
A method for fabricating an electronic assembly comprises attaching an insulative film to a frame and positioning at least one electronic component having a face with connections pads face down on the insulative film. The insulative film is positioned on a porous sheet supported by a vacuum fixture. The porous sheet and vacuum fixture are adapted so as to be capable of creating vacuum conditions for holding the insulative film with a substantially flat surface on the porous sheet. A vacuum is created within the vacuum chamber for flatly holding the insulative film on the porous sheet. A substrate is applied to the insulative film and the at least one electronic component. In one embodiment the substrate is applied by securing the insulative film in position with a mold form having at least one opening around the electronic component and adding substrate molding material at least partially around the component through the opening. In another embodiment the substrate is applied by providing a substrate having at least one well therein and positioning the insulative film over at least a portion of the substrate and the electronic component into the well.

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IBM Technical Disclosure Bulletin, vol. 6, No. 7, Dec. 1963, p. 61.

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