Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1998-07-30
2000-01-25
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257712, 257716, 257778, 257777, 257724, 257723, H01L 2328, H01L 2334, H01L 23473, H01L 23367
Patent
active
060181923
ABSTRACT:
An electronic device (10) having a thermal control capability is disclosed. The electronic device includes a substrate (16), a signal conductive region (26) disposed on at least a portion of the substrate, the signal conductive region configured to provide a signal path, and a first semiconductor die (12) having an active surface (18) and a back surface (20). The back surface is configured with a plurality of bubbler cavities positioned to receive a cooling fluid (24). In addition, the first semiconductor die includes a first plurality of solder bumps (30) disposed on the active surface, the first plurality of solder bumps contiguous with, and electrically coupling the active surface to the signal conductive region. Further, an electrically reactive metal region (402) in communication with the signal conductive region is sized to provide a location for real-time iterative tuning of the electronic device.
REFERENCES:
patent: 3268975 (1966-08-01), Emeis
patent: 5010036 (1991-04-01), Calviello et al.
patent: 5198889 (1993-03-01), Hisano et al.
patent: 5239200 (1993-08-01), Messina et al.
patent: 5705850 (1998-01-01), Ashiwake et al.
patent: 5751062 (1998-05-01), Daikoku et al.
patent: 5763950 (1998-06-01), Fujisaki et al.
patent: 5777384 (1998-07-01), Root et al.
Root Loren Francis
Sehmbey Maninder Singh
Beladi Sayed Hossain
Motorola Inc.
Williams Alexander Oscar
LandOfFree
Electronic device with a thermal control capability does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic device with a thermal control capability, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device with a thermal control capability will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2317755