Method of manufacturing a chip carrier

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29827, 29838, 72337, 174 524, H01R 4316

Patent

active

048296694

ABSTRACT:
A method of manufacturing a chip carrier having the J-shaped leads extending from the lateral sides of the enclosure of the chip carrier with the end facing the bottom of the enclosure is disclosed. The leads first extending laterally is made to have a circular arc at its end portion by use of a roller and then bent downward by using a die and then a roller, hollowed by being further curled by use of a roller to bring the end therefo to face the bottom of the enclosure.

REFERENCES:
patent: 3416348 (1968-12-01), Carter, Jr. et al.
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4463217 (1984-07-01), Orcutt
patent: 4465898 (1984-08-01), Orcutt et al.
patent: 4495376 (1985-01-01), Hightower et al.
patent: 4553420 (1985-11-01), Fierkers et al.
patent: 4611398 (1986-09-01), Eames et al.
patent: 4698660 (1987-10-01), Kubola et al.
IBM Tech. Discl. Bull., vol. 1, No. 4, Dec. 1958, by Vullemier, p. 28.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a chip carrier does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a chip carrier, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a chip carrier will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2312589

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.