Electrical method of making conductive paths in silicon

Metal working – Method of mechanical manufacture – Assembling or joining

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29584, 29585, 29591, 148 15, 148171, 148183, 148187, 204130, H01L 21326

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045341001

ABSTRACT:
A method of forming an electrical conductive path between parallel surfaces of a substrate is disclosed wherein a pulsed voltage, non-current limited, power supply causes aluminum to electromigrate between at least two opposing points to form an alloy with silicon of the substrate. Electronic devices can be thus contacted through said conductive path and thus placed upon opposite sides of the substrate for purposes of packaging, shielding, etc.

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