Low temperature tin-bismuth electroplating system

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly alloy coating

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205253, 205254, 204DIG13, C25D 360

Patent

active

052270467

ABSTRACT:
A system for electroplating a tin-bismuth alloy at near eutectic composition is disclosed. The system includes the plating bath and the process for initially preparing the bath as well as the process for plating an object with tin-bismuth alloy. The system further includes an apparatus for regulating the concentrations of tin and bismuth in the plating bath and the process by which the concentrations are controlled.

REFERENCES:
patent: 3360446 (1967-12-01), Jongkind
patent: 4518465 (1985-05-01), Morimoto et al.
patent: 5039576 (1991-08-01), Wilson

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