Process of mounting semiconductor chips in a full-width-array im

Details Process of mounting semiconductor chips in a full-width-array im Process of mounting semiconductor chips in a full-width-array im

1995-04-03

1996-04-23

Fourson, George

Fishing, trapping, and vermin destroying

437 53, 437205, 437212, 437214, 437216, 437249, H01L 2156, H01L 2158, H01L 21603, H01L 2170

Patent

active

055102735

ABSTRACT:
A process for manufacturing semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. Before chips are tacked onto the substrate with uncured epoxy, the substrate is urged evenly against a work surface defining a concave bow. The radius of curvature of the concave bow is calculated as a function of the desired spacing between adjacent chips. When the substrate having chips tacked thereon is released form the work surface, neighboring chips have parallel adjacent surfaces of the desired spacing.

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patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5318926 (1994-06-01), Dlugokecki

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