Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1984-04-09
1986-03-18
Grimley, A. T.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
357 74, H01L 2310
Patent
active
045770565
ABSTRACT:
The present invention is directed to a hermetically sealed package adapted to form an enclosure for a semiconductor device. The package comprises a substrate with a refractory oxide layer on one surface and a metallized band on the refractory oxide layer. A metal cover is disposed on the substrate and sealed to the metallized band. A lead frame disposed between the substrate and cover comprises a plurality of lead elements which extend into the enclosure to be electrically connected to the semiconductor device. The lead frame has a refractory oxide layer on its surface to electrically insulate the lead frame from both the substrate and the cover. The lead frame also has a metallized band on its refractory oxide layer. A solder component bonds the cover onto the substrate with the lead frame extending therebetween so that the electronic device is sealed within the closure.
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"Non-Hermetic Packaging for Hybrid Microcircuits" by Sergent et al., Electronic Packaging and Production, May, 1982, pp. 170-180.
"Hermetic Packages and Sealing Techniques", by Aaron Weiss, Semiconductor International, Jun., 1982, pp. 111-119.
Cohn Howard M.
Grimley A. T.
Kelmachter Barry L.
Olin Corporation
Tone D. A.
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