Thermoelectric cooling assembly with optimized fin structure for

Refrigeration – Using electrical or magnetic effect – Thermoelectric; e.g. – peltier effect

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

622592, 165 802, 165185, 136204, H01L 3528

Patent

active

054560810

ABSTRACT:
A configuration of solid state thermoelectric heat transfer or removal elements is provided to enhance the rate and amount of heat removal from electrical and electronic circuit devices. By rotating the thermoelectric heat transfer modules ninety degrees and by disposing them between the interdigitated fingers of a cold plate and a heat transfer plate possessing fins, improved thermal transfer is produced without the necessity of liquid coolants or moving part cooling devices. Accordingly, a method and apparatus is provided for enhancing heat transfer using thermoelectric modules. One embodiment of the present invention is particularly seen to be easy to manufacture. Additionally, this embodiment also possesses desirable heat transfer characteristics in terms of the cross sections of thermally conductive components.

REFERENCES:
patent: 2815472 (1957-12-01), Jackson et al.
patent: 2965819 (1960-12-01), Rosenbaum
patent: 2984077 (1961-05-01), Gaskill
patent: 2994203 (1961-08-01), Lackey et al.
patent: 4664309 (1987-05-01), Allen et al.
patent: 4770242 (1988-09-01), Daikoku et al.
patent: 4800956 (1989-01-01), Hamburgen
patent: 5232516 (1993-08-01), Hed
patent: 5276584 (1994-01-01), Collins et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermoelectric cooling assembly with optimized fin structure for does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermoelectric cooling assembly with optimized fin structure for, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermoelectric cooling assembly with optimized fin structure for will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2303573

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.