Semiconductor contact arrangement

Details Semiconductor contact arrangement Semiconductor contact arrangement

1988-11-16

1990-04-10

James, Andrew J.

357 65, H01L 2348, H01L 2944, H01L 2952

Patent

active

049165160

ABSTRACT:
A semiconductor contact arrangement comprising a semiconductor wafer having on one of its major faces an area of one type of conductivity and an electrical contact in face-to-face engagement with that area, in which the contact is located with respect to that area and is secured to the sandwich by a stud welded to the wafer and projecting into a hole extending through the contact from the face thereof engaged with the wafer.

REFERENCES:
patent: 3462349 (1969-08-01), Gorgeryi
patent: 3753053 (1973-08-01), Swartz
patent: 3781977 (1974-01-01), Hulmes
patent: 3783348 (1974-11-01), Swartz et al.
patent: 3831068 (1974-08-01), Kriepkamp
patent: 3912852 (1975-10-01), Simon
patent: 4173768 (1979-11-01), Denlinger et al.

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