High-density circuit module and process for producing same

Details High-density circuit module and process for producing same High-density circuit module and process for producing same

1990-03-19

1992-11-10

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

174 35R, 361399, H05K 900

Patent

active

051629712

ABSTRACT:
A high-density circuit module has a box shaped shielding case made from a plate blank which is bent to provide the shield case. A printed wiring board is placed on the bottom surface portion of the shielding case, and a plurality of electronic components are soldered to conductor lands of the printed wiring board. A plurality of externally connected leads are soldered to connection lands of the printed wiring board. A process for producing the high-density circuit module includes the steps of placing the printed wiring board on the blank, then soldering the electronic components and leads to the printed wiring board and then bending the blank to provide the shielding case. The plurality of externally connected leads are formed from a plurality of leads which are originally integrally connected to the bottom surface portion of the shielding case, by separating the plurality of leads form the bottom surface portion of the shielding case. A high-density circuit module having a small number of parts and a simple structure is easily manufactured.

REFERENCES:
patent: 4404617 (1983-09-01), Ohyama et al.
patent: 4628412 (1986-12-01), Nigorikawa
patent: 4649461 (1987-03-01), Matsuta
patent: 4725920 (1988-02-01), Ijichi et al.
patent: 4912604 (1990-03-01), Vaisanen

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