Volume phase type hologram film and photosensitive resin composi

Details Volume phase type hologram film and photosensitive resin composi Volume phase type hologram film and photosensitive resin composi

1993-01-25

1993-08-31

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Holographic process, composition, or product

430 2, 430290, 359 1, 359 3, G03H 102

Patent

active

052407950

ABSTRACT:
A volume phase type hologram film has a diffraction grating recorded in a film composed mainly of poly(N-vinylcarbazole). The poly(N-vinylcarbazole) as the main component has a weight-average molecular weight of not less than 1,000,000 and a molecular weight distribution of not more than 3. In the poly(N-vinylcarbazole), the content of a fraction of poly(N-vinylcarbazole) having a weight-average molecular weight of not more than 200,000 does not exceed 1% by weight.

REFERENCES:
patent: 3887369 (1975-06-01), Matsuno et al.
patent: 4201441 (1980-05-01), Matsumoto et al.
patent: 4258111 (1981-03-01), Matsumoto et al.
patent: 4348472 (1982-09-01), Jagt
patent: 4465768 (1984-08-01), Ueno et al.
patent: 4517266 (1985-05-01), Ikegami et al.
patent: 4871411 (1989-10-01), Kushibiki et al.
patent: 4908285 (1990-03-01), Kushibiki et al.
patent: 4946533 (1990-08-01), Kushibiki et al.
patent: 5026618 (1991-06-01), Kushibiki et al.
Patent Abstracts of Japan, vol. 7, No. 32 (P-174), JP-56-69861, [1177], Feb. 8, 1983.
Patent Abstracts of Japan, vol. 11, No 164 (P-580), JP-61-295548, [2611], May 27, 1987.

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