Multilayer series-connected coil assembly on a wafer and method

Details Multilayer series-connected coil assembly on a wafer and method Multilayer series-connected coil assembly on a wafer and method

1986-03-05

1986-12-02

Kozma, Thomas J.

Inductor devices

Winding with terminals, taps, or coil conductor end...

29602R, 336200, 336232, H01F 2728, H01F 4104

Patent

active

046268162

ABSTRACT:
A coil assembly has flat spiral conductive coils on an insulative slab. The coils are respectively covered by alternate insulative layers having open areas exposing inner ends of the coils to which conductive jumpers are connected. Outer ends of the coils are connected to other conductive pads on the slab. The coils are connected in series via the jumpers.

REFERENCES:
patent: 3798059 (1974-03-01), Astle et al.
patent: 4313151 (1982-01-01), Vranken
patent: 4547961 (1985-10-01), Bokil et al.
"Printed Delay Line", Altmann et al., IBM Technical Disclosure Bulletin, vol. 8, No. 5, Oct. 1965, pp. 741-742.

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