Method of fabricating multi-chip packages

Details Method of fabricating multi-chip packages Method of fabricating multi-chip packages

1995-05-01

1998-07-28

Niebling, John

Fishing, trapping, and vermin destroying

437902, 437205, 257778, H01L 2160

Patent

active

057862303

ABSTRACT:
A method of fabricating a multi-chip package including an aluminum silicon substrate with an aluminum nitride layer thereon forming an electrically insulated surface and aluminum heat conductive areas positioned on the insulated surface. Conductors on the surface of the substrate defining mounting areas and external connections with each mounting area positioned adjacent an associated one of the heat conductive areas and a semiconductor chip mounted in each mounting area. Heat conductive elements connected to the rear surface of each chip and to the associated one of the plurality of heat conductive areas, and each chip encapsulated with reworkable encapsulant.

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Chung-Daw Young et al., "Indirect Bonding of Ni-Electroless Plated A1N and Cu by Hot Pressing Method", IEEE Transactions On Components, Packaging, And Manufacturing Technology-Part A., vol. 17 No. 4, Dec. 1994, pp. 644-653.
"Flip-Chip attachment Heatsink with Decoupling Capacitor", IBM Technical Bulletin, vol. No. 37, 06A, p. 187, Jun. 1, 1994.

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