Semiconductor device free from short-circuit due to resin pressu

Details Semiconductor device free from short-circuit due to resin pressu Semiconductor device free from short-circuit due to resin pressu

1995-09-22

1998-03-24

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257669, 257674, 257691, 174 524, H01L 23495, H01L 23522

Patent

active

057319626

ABSTRACT:
A semiconductor chip mounted on an island is electrically connected to inner leads through tape-automated bonding leads supported by an insulating suspender tape, and a support ring is connected between the insulating suspender tape and suspender pins connected to the island so as to maintain an original relative position between the semiconductor chip and the tape-automated bonding leads during a molding stage.

REFERENCES:
patent: 4951120 (1990-08-01), Hagiwara et al.
"Development of Ultra Fine QFP", NEC Technical Report, vol. 47, No. Mar. 1994, pp. 34-37.

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