Method for annealing compound semiconductor devices

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437160, 437164, 437247, 437919, 437913, H01L 21265, H01L 2124

Patent

active

051622424

ABSTRACT:
A method of fabricating a compound semiconductor device is disclosed. The method includes forming a compound semiconductor substrate, depositing an insulator film on that substrate, then depositing a second film containing a refractory metal on the insulator film. The method further includes annealing the substrate-insulator film-refractory metal containing film composite in an inert gas atmosphere excluding a toxic substance.

REFERENCES:
patent: 4058413 (1977-11-01), Welch et al.
patent: 4267014 (1981-05-01), Davey et al.
patent: 4312681 (1982-01-01), Rupprecht et al.
patent: 4357180 (1982-11-01), Molnar
patent: 4396437 (1983-08-01), Kwok et al.
patent: 4713354 (1987-12-01), Egawa et al.
patent: 4820651 (1989-04-01), Prince et al.
patent: 4830987 (1989-05-01), Miller et al.
patent: 4954852 (1990-09-01), Lemnios
P. G. Young & V. J. Kapoor, "Silicon Nitride and Silicon Dioxide Films for MISFET's on Indium Phosphide", Proceedings of the Symposium on Dielectric Films on Compound Semiconductors [Honolulu, HI Oct. 18-23, 1987], Electrochem Soc. vii +332pages, 151-179 (1988).
J. Kasahara, M. Arai & N. Watanabe, Capless Anneal of Ion-Implanted GaAs in Controlled Arsenic Vapor, J. Appl. Phys. 50(1), pp. 541-543 (Jan. 1979).
K. Asai, H. Sugahara, Y. Matsuoka & M. Tokumitsu, Reactively Sputtered WSiN Film Suppresses As and Ga Outdiffusion, J. Vacuum Sci. Technol. B 6(5), pp. 1526-1529 (Sep. Oct. 1988).
T. Onuma, T. Hirao and T. Sugawa, Study of Encapsulants for Annealing Si-Implanted GaAs, J. Electrochem. Soc'y 129(4), (Apr. 1982).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for annealing compound semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for annealing compound semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for annealing compound semiconductor devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2292106

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.