Fishing – trapping – and vermin destroying
Patent
1991-11-13
1992-11-10
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437160, 437164, 437247, 437919, 437913, H01L 21265, H01L 2124
Patent
active
051622424
ABSTRACT:
A method of fabricating a compound semiconductor device is disclosed. The method includes forming a compound semiconductor substrate, depositing an insulator film on that substrate, then depositing a second film containing a refractory metal on the insulator film. The method further includes annealing the substrate-insulator film-refractory metal containing film composite in an inert gas atmosphere excluding a toxic substance.
REFERENCES:
patent: 4058413 (1977-11-01), Welch et al.
patent: 4267014 (1981-05-01), Davey et al.
patent: 4312681 (1982-01-01), Rupprecht et al.
patent: 4357180 (1982-11-01), Molnar
patent: 4396437 (1983-08-01), Kwok et al.
patent: 4713354 (1987-12-01), Egawa et al.
patent: 4820651 (1989-04-01), Prince et al.
patent: 4830987 (1989-05-01), Miller et al.
patent: 4954852 (1990-09-01), Lemnios
P. G. Young & V. J. Kapoor, "Silicon Nitride and Silicon Dioxide Films for MISFET's on Indium Phosphide", Proceedings of the Symposium on Dielectric Films on Compound Semiconductors [Honolulu, HI Oct. 18-23, 1987], Electrochem Soc. vii +332pages, 151-179 (1988).
J. Kasahara, M. Arai & N. Watanabe, Capless Anneal of Ion-Implanted GaAs in Controlled Arsenic Vapor, J. Appl. Phys. 50(1), pp. 541-543 (Jan. 1979).
K. Asai, H. Sugahara, Y. Matsuoka & M. Tokumitsu, Reactively Sputtered WSiN Film Suppresses As and Ga Outdiffusion, J. Vacuum Sci. Technol. B 6(5), pp. 1526-1529 (Sep. Oct. 1988).
T. Onuma, T. Hirao and T. Sugawa, Study of Encapsulants for Annealing Si-Implanted GaAs, J. Electrochem. Soc'y 129(4), (Apr. 1982).
Ikeda Yoshito
Tamura Akiyoshi
Fleck Linda J.
Hearn Brian E.
Matsushita Electric - Industrial Co., Ltd.
LandOfFree
Method for annealing compound semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for annealing compound semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for annealing compound semiconductor devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2292106