Target for sputter depositing thin films

Details Target for sputter depositing thin films Target for sputter depositing thin films

1985-05-02

1986-12-02

Niebling, John F.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

2041922, C23C 1434

Patent

active

046263365

ABSTRACT:
A sputtering target has a sputtering surface with first and second regions of repsective first and second materials. The first region comprises a surface of a first member of the first material, such as of a circular cobalt plate. The second region comprises a surface of a second member of the second material, such as a platinum ring. A cobalt cover ring clamps the platinum ring to the cobalt plate. By varying the relative sizes of the first and second regions, as by changing the size of the cover ring to expose more or less of the platinum ring, the concentration of the two materials in a layer deposited from the target onto substrates is varied. In addition, by imparting planetary motion to substrates during deposition and sizing and positioning the exposed portion of the platinum ring, a radial coercivity gradient is established in the layer deposited on the substrates.

REFERENCES:
patent: 3716472 (1973-02-01), Kausche
patent: 3855612 (1974-12-01), Rosvold
patent: 3985635 (1976-10-01), Adam et al.
patent: 4260466 (1981-04-01), Shirahata et al.
patent: 4415427 (1983-11-01), Hidler et al.
patent: 4430190 (1984-02-01), Eilers et al.
patent: 4468313 (1984-08-01), Okumura et al.
patent: 4485000 (1984-11-01), Kawaguchi et al.
patent: 4505798 (1985-03-01), Ramachandran et al.

Affiliated with

Also associated with

Rating

Target for sputter depositing thin films does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Target for sputter depositing thin films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Target for sputter depositing thin films will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2291323