Hot melt adhesives containing poly(p-hydroxystyrene) homopolymer

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156313, 1563309, 156334, 428349, 525184, 525229, 525241, 526313, 5263292, 526346, C09J 500

Patent

active

RE0341223

ABSTRACT:
A hot melt adhesive composition which is especially useful for bonding polyamide article to surfaces, particularly polyamide surfaces. The composition contains an ethylene-vinyl ester copolymer or a polyamide polymer, and additionally contains a poly(p-hydroxystyrene) homopolymer or a copolymer of poly(p-hydroxystyrene) with a C.sub.1 to C.sub.4 alkyl acrylate.

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