Integrated optic circuit

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350 9612, G02B 612

Patent

active

047296186

ABSTRACT:
An integrated optic circuit according to the present invention is produced as a hybrid integrated optic circuit using two or more kinds of substrates in which only the portion of high performance and high degree of integration is formed of the substrate of a material of high cost and high performance while the other portion of lower degree of integration is formed of the substrate of a material of low cost. Therefore, in the integrated optic circuit according to the present invention, the distance between the waveguides to be coupled with optical fibers can be larger than the outside diameter of the optical fiber, and the integrated optic circuit according to the present invention can be produced easily at low cost.

REFERENCES:
patent: 4005927 (1977-02-01), Caton
patent: 4144503 (1979-03-01), Itoh et al.
patent: 4152044 (1979-05-01), Liu
patent: 4166669 (1979-09-01), Leonberger et al.
patent: 4203649 (1980-05-01), Velasco et al.
patent: 4211467 (1980-07-01), Cross et al.
patent: 4251130 (1981-02-01), Marcatili
"Flip-Chip Approach to Entire Coupling Between Single Mode Optical Fibers and Channel Waveguides", by Electronics Letters, Hsu et al, vol. 12, No. 16, 5th Aug. 1976 (pp. 404-405).
"Optical Waveguide in GaAs-AlGaAs Epitaxial Layers", by Logan et al, J. Appl. Phys., vol. 44, No. 9, Sep. 1973.
"Chemical Etching of InP and GaInAsP for Fabricating Laser Diodes & Integrated Optical Circuits", by Kambayash, Japanese Journal of Applied Physics, vol. 19, No. 1, Jan. 1980, pp. 79-85.

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