Method of forming bump electrodes

Details Method of forming bump electrodes Method of forming bump electrodes

1991-02-04

1992-03-10

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29842, 29877, 228179, H01R 909

Patent

active

050939866

ABSTRACT:
A method of forming bump electrodes, which is characterized in that conductive pastes are applied to a surface on which bump electrodes are to be formed, metal balls are made to adhere to the applied conductive pastes utilizing the viscosity of the conductive pastes before the conductive pastes are dried, and the conductive pastes and the metal balls are cofired.

REFERENCES:
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 4829664 (1989-05-01), Kabeshita et al.
patent: 4857482 (1989-08-01), Saito et al.
Martin, B. D. et al., Chip Protective Coating, IBM Tech. Discl., Bull., vol. 23, No. 5, Oct. 1980.

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