Curable thermosetting cyanate ester composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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525 65, 525 66, 525 92, 5253319, 525374, 525404, 525407, 525523, 428417, 428418, 428461, 428441, 524404, 524425, 524509, 524456, 523466, C08L 2510, C08L 0200

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047805072

DESCRIPTION:

BRIEF SUMMARY
DESCRIPTION

1. Technical Field
The present invention relates to a novel curable resin composition which has good handling properties and will provide a cured product having improved heat resistance, bonding properties and electrical characteristics. Because of its good dielectric characteristics, the resin composition of the present invention will find particular use in the manufacture of laminations in printed circuit boards, shaped structural articles and paints requiring low dielectric constant and low dielectric loss tangent.
2. Background Art
The curable resin composition that is used as component (A) in the present invention and which consists essentially of a polyfunctional cyanate ester (a) and/or another thermosetting resin (b) has good handling properties and superior heat resistance and bonding properties but is not completely satisfactory for use in applications where low dielectric constant and low dielectric loss tangent are required. On the other hand, 1,2-polybutadiene based resins are capable of providing cured products having low dielectric constant and low dielectric loss tangent but then their bonding and handling properties are not satisfactory.
With a view to solving this incompartibility problem, compositions made of polyfunctional cyanate esters and 1,2-polybutadiene based resins have been proposed (Japanese Patent Publication (kokai) Nos. 142300/1979 and 98244/1980). However, conventionally liquid 1,2-polybutadiene based resins having molecular weights of about 1,000-5,000 are not highly compartible with the polyfunctional cyanate esters and the resulting viscous compositions are unsuitable for use in applications such as prepregs, molding pellets or powder paint coatings which must be tack-free. A method has been proposed for eliminating this problem by using 1,2-polybutadiene resins having molecular weights of about 100,000 but they are not easy to handle since they do not have high compartibility with the cyanate esters or have high solubility in common solvents. The defect which is common to these prior art methods is that the resulting resin compositions do not have good bonding properties. A method exists that introduces an acid anhydride group into 1,2-polybutadine by attaching maleic anhydride at its double bond (Japanese Patent Publication (kokai) No. 143350/1982); the resin using this modified 1,2-polybutadine exhibits good properties with respect to adhesion and heat resistance but it still has the disadvantage of tackiness.


DISCLOSURE OF INVENTION

The present inventors made concerted efforts to obtain a resin composition that has appreciably improved handling properties over the prior art products and which is capable of providing tack-free prepregs, powders and molding pellets. As a result, the inventors have found that a novel curable resin composition that has good handling properties and which is capable of providing a cured product having improved adhesion, heat resistance and electrical characteristics can be obtained by modifying the cyanate ester based resin composition with a butadiene based resin which is either a specified copolymer of butadiene and an aromatic vinyl monomer or an epoxy resin modified butadiene based copolymer which is obtained by modifying a certain type of said butadiene-based copolymer with a polyfunctional epoxy resin.
This invention relates to a thermosetting resin composition comprising a thermosetting cyanate ester resin composition (A) and a butadiene based copolymer (B) (i) or an epoxy resin-modified butadiene based copolymer (B) (ii), in which said component (B) (i) or (B) (ii) are used for modifying said component (A), components (A) and (B) being as follows; ester compound selected from the group consisting of, molecule, monomer copolymer having 0.5 or more functional groups selected from a group consisting of carboxyl radical, hydroxyl radical, acid anhydride radical, melcapto radical, epoxy radical and amino radical and a melting point of 10.degree. C. or more, in which 1,2-type content in butadiene structure of copolymer ch

REFERENCES:
patent: 4110364 (1978-08-01), Gaku et al.
patent: 4396679 (1983-08-01), Gaku et al.
patent: 4403073 (1983-09-01), Ikeguchi
patent: 4585855 (1986-09-01), Gaku et al.

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