Distributed constant circuit board using ceramic substrate mater

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428209, 428210, 428323, 428325, 428332, 428402, 428432, 428433, 428457, 428901, B32B 300

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052327655

ABSTRACT:
A distributed constant circuit board including a ceramic substrate, and at least one conductor pattern which is carried by the ceramic substrate and which forms a resonance circuit, an inductor, a capacitor or strip transmission line. The conductor pattern has an electrically conductive composition whose major component is selected from the group consisting of Ag, Au and Cu, and which has a sheet resistivity not higher than 10 m.OMEGA. per square. The conductor is formed by co-firing with the ceramic substrate, so that the conductor pattern is incorporated in the substrate. The ceramic substrate is formed principally of a ceramic composition which gives the resonance circuit a resonance frequency whose temperature coefficient is held within a range between -30 ppm/.degree. C. and +100 ppm/.degree. C.

REFERENCES:
patent: 4301324 (1981-11-01), Kumar et al.
patent: 4620264 (1986-10-01), Ushifusa et al.
patent: 4794048 (1988-12-01), Oboodi et al.
patent: 4883705 (1989-11-01), Kawakami et al.
patent: 4899118 (1990-02-01), Polinski, Sr.
Patent Abstracts of Japan vol. 14, No. 242 (C-721), May 23, 1990 & JP-A-2,064,059 (Murata Mfg Co.) Mar. 5, 1990.
IEEE, Proceedings of the 36th. Electronic Components Conference 1986, New York, US pp. 37-47; A. L. Eustice et al.: "Low Temperature Co-firable Ceramics: A New Approach for Electronic Packaging." p. 38, left col., paragraph 2-p. 39, right col., paragraph 2.
World Patents Index Latest Week 8223, Derwent Publications, Ltd., London, GB; AN 82-46708E & JP-A-57,069,607 (Alps Electric Co.) Apr. 28, 1982.

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