Process for producing adherent, electrochemically reinforcible a

Details Process for producing adherent, electrochemically reinforcible a Process for producing adherent, electrochemically reinforcible a

1986-10-08

1988-10-25

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427433, B05D 512

Patent

active

047803320

ABSTRACT:
A screen-printing paste containing Cu.sub.2 O or NiO and preferably aluminum oxide or, more preferably, an aluminum compound such as aluminum acetylacetonate which forms aluminum oxide under calcination heat, is printed over an entire surface of a substrate consisting of aluminum oxide ceramic, after which it is calcined in air at from 800.degree. to 1350.degree. C. to produce an adhesion-promoting spinel layer. That layer is then metallized by plating in an electroless bath for deposition of copper or nickel, as the case may be, after which the metal layer thus deposited is reinforced galvanically. A positive photoresist layer can be applied to the electroless deposited copper or nickel layer, illuminated through an appropriate mask and developed to expose a desired pattern of the underlying electroless copper layer for galvanic reinforcement, so that after removal of the unexposed portion of the mask the unreinforced electroless layer can be removed by etching without impairment of the reinforced conducting pattern.

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Gerald Katz "Adhesion of Copper Films to Aluminum Oxide Using a Spinel Structure Interface" Thin Solid Films, vol. 33, 1976, pp. 99-105.
M. Wittmer, C. R. Boer, P. Gudmundson, J. Carlson, "Mechanical Properties of Liquid-Phase-Bonded Copper-Ceramic Substrates, May 13, 1981, pp. 149-153, Journal of the American Ceramic Society.

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