Method of making semiconductor casing

Details Method of making semiconductor casing Method of making semiconductor casing

1984-08-09

1986-06-17

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29589, 174 52FP, H01L 2152, H01L 2150, H01L 2340, H01L 2310

Patent

active

045947708

ABSTRACT:
A casing for an electrical component comprises a metal lead frame having the electrical component connected thereto. A metal base member is bonded to one surface of the lead frame. A plastic housing member is bonded to a second surface of the lead frame. An adhesive seals and bonds the metal base member and plastic housing member to the lead frame so as to enclose the electrical component.

REFERENCES:
patent: 3341369 (1967-09-01), Caule et al.
patent: 3676292 (1972-07-01), Pryor et al.
patent: 3943623 (1976-03-01), Mizutani et al.
patent: 4079511 (1978-03-01), Grabbe
patent: 4105861 (1978-08-01), Hascoe
patent: 4107555 (1978-08-01), Haas et al.
patent: 4126758 (1978-11-01), Krumme
patent: 4266239 (1981-05-01), Miyagaki et al.
patent: 4278990 (1981-07-01), Fichot
patent: 4293768 (1981-10-01), Adachi et al.
patent: 4323405 (1982-04-01), Uno et al.
patent: 4330790 (1982-05-01), Burns
patent: 4345108 (1982-08-01), Dathe et al.
patent: 4480262 (1984-10-01), Butt
Neighbour et al., "Factors Governing Aluminum Interconnection Corrosion in Plastic Encapsulated Microelectronic Devices", Microelectronics and Reliability, Pergamon Press, Great Britain, vol. 16, 1977, pp. 161-164.
Olberg et al., "Factors Contributing to the Corrosion of the Aluminum Metal On Semiconductor Devices Packaged in Plastics", Microelectronics and Reliability, Pergamon Press, Great Britain, vol. 15, 1976, pp. 601-611.

Affiliated with

Also associated with

Rating

Method of making semiconductor casing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making semiconductor casing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making semiconductor casing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2266349