Method of forming insulator of selectively varying thickness on

Details Method of forming insulator of selectively varying thickness on Method of forming insulator of selectively varying thickness on

1984-06-15

1986-06-17

Ozaki, George T.

Metal working

Method of mechanical manufacture

Assembling or joining

29580, 148187, 156657, H01L 21465

Patent

active

045947694

ABSTRACT:
A structure having substantial surface evenness is created by a method in which an insulating layer (24) that has an upward protrusion (26) is formed on a patterned conductive layer (20) having a corresponding upward protrusion (22). A further layer (28) having a generally planar surface is formed on the insulating layer. Using an etchant that attacks the further layer much more than the insulating layer, the further layer is etched to expose at least part of the insulating protrusion. The further layer and the insulating layer (as it becomes exposed) are then etched with an etchant that attacks both of them at rates not substantially different from each other. This brings the upper surface down without exposing the conductive layer, particularly its upward protrusion.

REFERENCES:
patent: 3962779 (1976-06-01), Edwards et al.
patent: 4025411 (1977-05-01), Hom-Ma et al.
patent: 4044454 (1977-08-01), Magdo
Adams et al., J. Electrochem. Soc.: Solid-State Sci. and Tech., vol. 128, No. 2, Feb. 1981, pp. 423-429.
Oh et al., Extended Abstracts: 164th Electrochem. Soc. Meeting, vol. 83-2, Wn., D.C., Oct. 9-14, 1983, pp. 327 and 328.
Fried et al., IBM J. Res. Develop., vol. 26, No. 3, May 1982, pp. 362-371.

Affiliated with

Also associated with

Rating

Method of forming insulator of selectively varying thickness on does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming insulator of selectively varying thickness on , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming insulator of selectively varying thickness on will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2266342