Method of fabricating an array of flexible metallic interconnect

Metal working – Method of mechanical manufacture – Electrical device making

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29578, 29591, 29628, 361412, 427123, 427264, H05K 330, H05K 336

Patent

active

040671046

ABSTRACT:
A method of interconnecting microelectronic components with flexible metallic interconnects. A layer of photoresist is applied to the surface of a microelectronic component and then removed from selected locations. A deposit of metal is applied to the selected location. A second layer of photoresist is applied over the first layer and over the deposited metal. The second layer of photoresist is removed from above the metal deposit and a second metal deposit is applied over the first metal deposit. These steps are repeated until a predetermined height of deposited metal is reached supported by layers of photoresist. The upper surface of the deposit and photoresist is polished flat and pads of metal deposited. A second microelectronic component having mating metal pads is positioned over the first microelectronic component and bonded to it through the mating metal pads. Finally, the layers of photoresist are removed.

REFERENCES:
patent: 3447960 (1969-06-01), Tonozzi
patent: 3795037 (1974-03-01), Luttmer
patent: 3829601 (1974-08-01), Jeannotte et al.
patent: 3904461 (1975-09-01), Estep et al.

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