Multi-chip die bonder

Details Multi-chip die bonder Multi-chip die bonder

1991-07-19

1993-08-03

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 9, H01L 2150

Patent

active

052321436

ABSTRACT:
A multi-chip semiconductor die bonder having a plurality of die handling chucks (23) and associated collets (14) which serve to pick up a plurality of semiconductor die (16) then position and bond each semiconductor die in position on a package (17). A plurality of mechanically controlled slides serve to move and correctly position both the plurality of semiconductor die (16) and the package (17) during the bonding process. The die bonder can bond the plurality of semiconductor die (16) in the package (17) without requiring repeated handling of the semiconductor die (16) and packages (17). The collets (14) are mounted on a removable collet guide block assembly (39) to minimize setup time.

REFERENCES:
patent: 4881319 (1989-11-01), Yagi et al.

Affiliated with

Also associated with

Rating

Multi-chip die bonder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-chip die bonder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-chip die bonder will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2264744