Hermetically sealed glass fiber bushing

Details Hermetically sealed glass fiber bushing Hermetically sealed glass fiber bushing

1987-11-12

1988-10-25

Jordan, M.

Metal fusion bonding

Miscellaneous

228215, 228221, B23K 119, B23K 300

Patent

active

047797886

ABSTRACT:
To avoid having to metallize a bare glass fiber prior to soldering it into a hole of a metal part to obtain a hermetically sealed lead-through bushing, the solder is permitted to shrink onto the glass fiber. This is achieved by either soldering an additional solder body to the metal part outside the hole or providing the wall of the hole with a nonsolderable coating over part of its length. If the metal part is designed as a sleeve, a recess exposing part of the hole causes the solder to firmly shrink on to the bare glass fiber during solidification. The hermetic seal is obtained by arranging the connections of the solder with the metal part and with the glass fiber essentially one behind the other in the longitudinal direction of the glass fiber.

REFERENCES:
patent: 4131905 (1978-12-01), Hanes et al.
patent: 4580874 (1986-04-01), Winter et al.
patent: 4615031 (1986-09-01), Eales et al.
patent: 4741589 (1988-05-01), Halder et al.

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