Heat exchanger for solid-state electronic devices

Details Heat exchanger for solid-state electronic devices Heat exchanger for solid-state electronic devices

1992-01-14

1993-08-03

Flanigan, Allen J.

Heat exchange

Conduit within, or conforming to, panel or wall structure

165 804, 165185, F28F 702

Patent

active

052320472

ABSTRACT:
A microscopic laminar-flow heat exchanger, well-suited for cooling a heat generating device such as a semiconductor integrated circuit, includes a plurality of thin plates, laminated together to form a block. Each plate has a microscopic recessed portion etched into one face of the plate and a pair of holes cut through the plate such that when the block is formed, the holes align to form a pair of coolant distribution manifolds. The manifolds are connected via the plurality of microscopic channels formed from the recessed portions during the lamination process. Coolant flow through these channels effectuates heat removal.

REFERENCES:
patent: 2129300 (1938-09-01), Bichowsky
patent: 3347422 (1967-10-01), Mead et al.
patent: 4602674 (1986-07-01), Eriksson
patent: 4747450 (1988-05-01), Ikegame et al.
patent: 4993487 (1991-02-01), Niggemann
patent: 5034688 (1991-07-01), Moulene et al.

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