Structure, method of, and apparatus for mounting semiconductor d

Details Structure, method of, and apparatus for mounting semiconductor d Structure, method of, and apparatus for mounting semiconductor d

1990-02-28

1992-03-31

Tolin, Gerald P.

Electricity: electrical systems and devices

Miscellaneous

361417, 174 522, 357 72, H05K 702

Patent

active

051013240

ABSTRACT:
Semiconductor devices are each arranged such that a semiconductor chip is disposed on a film carrier, fingers of the film carrier are respectively connected to a multiplicity of electrodes provided on the semiconductor chip, and the fingers are then trimmed, or the fingers are trimmed after the semiconductor chip and parts of the fingers are sealed with a resin or the like. The semiconductor devices thus arranged are respectively mounted on both obverse and reverse surfaces of a substrate at mutually opposing positions thereof, the substrate having electrically conductive patterns formed on both surfaces thereof. The semiconductor devices are sealed with a resin or the like so as to be formed integrally with the substrate.

REFERENCES:
patent: 3395318 (1968-07-01), Laermer et al.
patent: 4079511 (1978-03-01), Grabbe
patent: 4423468 (1983-12-01), Gatto et al.
patent: 4933810 (1990-07-01), Cardashian et al.

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