Metallic fuse with optically absorptive layer

Details Metallic fuse with optically absorptive layer Metallic fuse with optically absorptive layer

1989-01-30

1990-06-19

Carroll, J.

357 71, H01L 2702, H01L 2348

Patent

active

049358014

ABSTRACT:
A metallic interconnect includes a fuse portion that is readily vaporized upon exposure to the radiant energy of a laser. A layer of optically absorptive material is formed on top of an aluminum based metallic interconnect and together they are formed by a photolithographic and etch technique into a fuse portion. A low energy laser having a Gaussian energy distribuution focused on the absorptive layer produces heat in the absorptive layer. The heat is transferred to the underlying aluminum based interconnect. The concentration of energy made possible by the absorptive layer allows the low energy laser to blow the fuse thereby producing an electrical open in the interconnect without damaging surrounding silicon substrate and/or polysilicon structures below or nearby the metal fuse.

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