Fishing – trapping – and vermin destroying
Patent
1991-01-31
1992-03-31
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437132, 437227, 437226, 148DIG12, 148DIG17, 148 333, 156250, 156296, H01L 21302
Patent
active
051008394
ABSTRACT:
A rod base material for forming wafers for electronic devices is formed from a plurality of rod members made of selected materials. The rods are assembled in parallel and are bonded with each other into an integrated body. In one aspect of this invention, a mirror-finished bonding face is formed at the outer surface of each of the rod members, and is cleaned by a surface treatment using chemicals. Subsequently, respective rod members are assembled in parallel and brought into contact with each other at their respective bonding faces. The thus prepared and assembled rod members are maintained in a heated atmosphere until they combine into an integrated body to provide the base material. The rod base material is thereafter subjected to slicing to provide wafers used for forming electronic devices. Since the rod base material has a structure in which a plurality of the rod members are assembled in parallel and bonded with each other into an integrated body, the overall diameter of the rod base material can be significantly large compared to the diameter of individual rods. Accordingly, the diameter of wafers obtained by slicing such rod base material is also increased remarkably, and the cost per electronic device formed on the wafer is correspondingly reduced.
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Nikkei Microdevices, Mar. 1988, pp. 82-98.
Hearn Brian E.
Mitsubishi Denki & Kabushiki Kaisha
Trinh Michael
LandOfFree
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