Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1986-10-08
1990-06-19
Gallagher, John J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29832, 156152, 1563073, 156313, 1563317, 524430, 524590, 524786, B32B 3100
Patent
active
049350862
ABSTRACT:
A thermally conductive adhesive, and processes for formulating the same, are provided for bonding an electrical device package, such as an integrated circuit (IC) package, to a surface of a substrate, such as a printed circuit board. The thermally conductive adhesive comprises a polyurethane-based resin material and a predetermined amount of thermally conducting, electrically insulating material, such as alumina, mixed therewith. With such arrangement, a thermally conductive adhesive is provided having a low modulus of elasticity. Thus, such adhesive is soft and pliable rather than rigid, and thus deforms in response to the different amounts of thermal expansion, or contraction, of the IC package and PCB against, or away from, the thermally-conductive adhesive, thereby preventing damage to either the IC package or PCB, or separation of solder joints therebetween, due to such thermal expansion or contraction. Additionally, such adhesive has a low bond strength, thus allowing an IC package to be removed from a PCB without damaging either the IC package or PCB. Also, such adhesive is found to have low outgassing properties. The thermally conductive adhesive may be formed into a film, mixed with a solvent and sprayed into a film, or applied directly to the PCB as paste-like substance.
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Baker Thomas E.
Girouard Nicki S.
Gallagher John J.
Maginniss Christopher L.
Raytheon Company
Sharkansky Richard M.
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