Material for a housing for shielding electronic components from

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428457, 428458, 428461, B32B 512, B32B 1508

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active

051007266

ABSTRACT:
A layered material for a housing that shields electronic components, comprising synthetic resin body reinforced with carbon fiber, which has superior mechanical properties and conductivity, and a metallic layer on its surface made of metal with high permeability, is light and endowed with high conductivity and high permeability wherein the housing prevents electromagnetic troubles of electronic components by concentrating magnetic flux from low-frequency magnetic field on the ferromagnetic layer spread on its outer surface.

REFERENCES:
patent: 4404125 (1983-09-01), Abolins et al.
patent: 4602051 (1986-07-01), Nabeta et al.
patent: 4816184 (1989-03-01), Fukuda et al.
patent: 4916016 (1990-04-01), Bristowe et al.
patent: 4960643 (1990-10-01), Lemelson
Examiner's Report to the Comptroller Under Section 17, Examiner M. J. Insley, Jan. 29, 1990, application No. 8924854.6.

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