Method of manufacturing a printed circuit board

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

4271263, C23C 2600

Patent

active

051006952

ABSTRACT:
A method of manufacturing a printed circuit board for use in an electronic circuit is disclosed. The method comprises steps of forming a printed circuit on an insulating base board, of forming a circuit portion to be connected to the printed circuit by adhering a conductive ink on the base board, and of adhering the conductive ink through an uneven surface formed on a terminal portion to be connected to the printed circuit.

REFERENCES:
patent: 4486466 (1984-12-01), Leech
patent: 4569902 (1986-02-01), Saito
patent: 4678529 (1987-07-01), Drake
patent: 4808434 (1989-02-01), Bennett
patent: 4814040 (1989-03-01), Ozawa

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