Semiconductor device

Details Semiconductor device Semiconductor device

1988-10-12

1990-06-19

Hille, Rolf

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 68, 357 45, 357 74, 174 524, H01L 2348, H01L 2944, H01L 2710, H02G 1308

Patent

active

049348205

ABSTRACT:
According to the present invention, a semiconductor chip is mounted on a zigzag in-line type package (ZIP) partially using a tabless lead frame and bonding pads are arranged on the chip so that the chip can be applied also to other different types of packages. As different types of packages there are a small out-line J-bent type package (SOJ) for which there is used a lead frame with tab and a dual in-line type package (DIP) for which there is used a tabless lead frame. Further, a plurality of bonding pad pairs are provided among the bonding pads on the chip each pad of such bonding pad pairs having the same function as the other pad associated therewith thereby duplicating a common function in different bonding pads on the semiconductor chip so as to readily facilitate, or make compatible, the semiconductor chip to a variety of or different types of packages.

REFERENCES:
patent: 4595945 (1986-06-01), Graver
patent: 4612564 (1986-09-01), Moyer
patent: 4688072 (1987-08-01), Heath et al.

Affiliated with

Also associated with

Rating

Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2256580