Encapsulating a solder joint with a photo cured epoxy resin or c

Details Encapsulating a solder joint with a photo cured epoxy resin or c Encapsulating a solder joint with a photo cured epoxy resin or c

1997-06-13

2000-10-10

Sellers, Robert E. L.

Coating processes

Direct application of electrical, magnetic, wave, or...

Polymerization of coating utilizing direct application of...

438127, 522 31, 522 32, C08F 248, C08F 250, H01L 2156

Patent

active

061299553

ABSTRACT:
An electronic package assembly where a low profile integrated circuit chip package is soldered to an organic (e.g., epoxy resin) substrate, e.g., a printed circuit board or card, the projecting conductive leads of the integrated circuit chip package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with ultraviolet photocured encapsulant material (e.g., an epoxy resin or a cyanate with a photoinitiator and silica) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder.

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