Wavelet analysis for laser ultrasonic measurement of material pr

Details Wavelet analysis for laser ultrasonic measurement of material pr Wavelet analysis for laser ultrasonic measurement of material pr

1996-04-18

1998-03-03

Font, Frank G.

Optics: measuring and testing

By dispersed light spectroscopy

Utilizing a spectrometer

356345, 356432T, G01B 902

Patent

active

057241384

ABSTRACT:
A laser ultrasonics technique is used to characterize a composite dispersive response signal from a sample under analysis, such as a semiconductor wafer. Rather than measuring individual acoustic wave velocities at specific frequencies, an entire dispersive response signal is analyzed. In a presently preferred embodiment of this invention the entire dispersive response signal is analyzed using a wavelet-based technique, such as a discrete wavelet transform analysis technique. The discrete wavelet transform analysis technique is shown to provide an accurate, non-contact measurement of the temperature of the wafer.

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