Thermoplastic resin composition and injection molded article the

Details Thermoplastic resin composition and injection molded article the Thermoplastic resin composition and injection molded article the

1996-04-24

1998-03-03

Mulcahy, Peter D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524423, 524301, 524529, 524394, 524400, 525 88, C08K 334

Patent

active

057235279

ABSTRACT:
A thermoplastic resin composition which has a melt flow rate of 20 to 30 g/10 min and a flexural modulus at 23.degree. C. of 30,000 kg/cm.sup.2 or more and which comprises (A) 60 to 75% by weight of a specific crystalline polypropylene in which the propylene homopolymer portion has a Q value of 3.0 to 5.0, an isotactic pentad fraction of 0.975 or more and an intrinsic tetralin, (B) 2 to 8% by weight of an ethylene-butene-1 copolymer rubber, (C) 2 to 8% by weight of an ethylene-propylene copolymer rubber, (D) 10 to 20% by weight of talc having an average particle diameter of 4 .mu.m or less, and (E) 5 to 20% by weight of fibrous magnesium oxysulfate, and an injection molded article of the thermoplastic resin composition, said thermoplastic resin composition satisfying the impact strength and rigidity required as a material for an instrumental panel and having a short molding cycle and good surface quality.

REFERENCES:
patent: 5039525 (1991-08-01), Tamashima et al.
patent: 5283267 (1994-02-01), Nishio et al.

Affiliated with

Also associated with

Rating

Thermoplastic resin composition and injection molded article the does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermoplastic resin composition and injection molded article the, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermoplastic resin composition and injection molded article the will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2248445