Diamond-impregnated hard material

Coating processes – Particles – flakes – or granules coated or encapsulated – Inorganic base

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427212, B05D 700

Patent

active

057231770

ABSTRACT:
According to the present invention there is provided a wear resistant material consisting of 3-60% by volume of diamond in a matrix containing at least one hard constituent consisting of carbide, nitride and/or carbonitride of one metal of group IV, V and VI in the Periodic Table and a binder phase based upon Co, Ni and/or Fe at which the diamonds are surrounded by a layer >1 .mu.m of refractory metals, carbides, nitrides, oxides, borides or silicides. In this way, a dissolution of diamonds during the sintering is prevented by a special combination of layer material and sintering compaction process.

REFERENCES:
patent: 1996598 (1935-04-01), Taylor
patent: 2411867 (1946-12-01), Brenner
patent: 2796706 (1957-06-01), Anderson
patent: 3757878 (1973-09-01), Wilder et al.
patent: 4124401 (1978-11-01), Lee et al.
patent: 4142869 (1979-03-01), Vereschagin et al.
patent: 4224380 (1980-09-01), Bovenkerk et al.
patent: 4274840 (1981-06-01), Houseman
patent: 4288248 (1981-09-01), Bovenkerk et al.
patent: 4636253 (1987-01-01), Nakai et al.
patent: 4694918 (1987-09-01), Hall
patent: 4919974 (1990-04-01), McCune et al.
patent: 5010043 (1991-04-01), Ringwood
patent: 5011514 (1991-04-01), Cho et al.
patent: 5151107 (1992-09-01), Cho et al.

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