Scalable fuse link element

Details Scalable fuse link element Scalable fuse link element

1987-06-01

1989-08-29

Carroll, J.

357 54, 357 71, H01L 2702, H01L 2934, H01L 2348

Patent

active

048622435

ABSTRACT:
A fuse link (50) is formed using a method which offers greater scalability of the general conductor system used to wire the device. An oxide mask (36) having the shape of a desired fuse link is formed over a thin metallization layer (34). A barrier layer (38) is formed over the thin metallization layer (34). A conductive layer (40) is formed over the barrier layer (38). A photoresist mask (42) supplied to the conductive layer (40), and the conductive layer is etched to formed interconnects (44, 46). Subsequently, the barrier layer (38) and thin metallization layer (34) are etched, thus rendering a fuse link (50) between interconnects (44, 46) under the oxide mask (36).

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patent: 4647340 (1987-03-01), Szluk et al.
patent: 4679310 (1987-07-01), Ramachandra et al.
patent: 4714949 (1987-12-01), Simmons et al.

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